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Process variations in integrated circuits have significant impact on their performance, leakage, and stability. This is particularly evident in large, regular, and dense structures such as DRAMs. DRAMs are built using minimized transistors with presumably uniform speed in an organized array structure. Process variation can introduce latency disparity among different memory arrays. With the proliferation...
Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and high-bandwidth fabric for interconnect design. The advent of the 3D technology has provided further opportunity to reduce on-chip communication delay. However, the design of the 3D NoC topologies has important distinctions...
Process variations in integrated circuits have significant impact on their performance, leakage and stability. This is particularly evident in large, regular and dense structures such as DRAMs. DRAMs are built using minimized transistors with presumably uniform speed in an organized array structure. Process variation can introduce latency disparity among different memory arrays. With the proliferation...
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and reduce the delay of interconnects across the dies. However, a major challenge in 3D technology is the increased power density which brings the concern of heat dissipation within the processor. High temperatures trigger voltage...
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