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In thermosonic wire bonding process, the bonding power setting and bonding temperature are important factors to the vibration of transducer system, which plays a crucial role in bonding formation. In a number of bonding experiments which were carried out at different power setting and temperature, vibration velocity at the tip of transducer was monitored. Vibration Signals were analyzed by wavelet...
In ultrasonic wire bonding, the local plastic zones play important roles in determining the wire profile. A way of detecting the local plastic zones using image processing was introduced in this paper. First we divided the video of wire bonding into continuous image sequences, after adaptive threshold segmentation, curve tracking, morphological opening and closing operator, finally we got the thinned...
The bonding quality as obtained by strength tests of thermosonic bonding has been investigated as function of bonding temperature and ultrasonic power. The results show that bonding quality is very sensitive to process temperature and power. Optimum bonding temperature is not identical at different ultrasonic power. Analogously, optimum ultrasonic power which appears between 0.36 W and 0.95 W is not...
Ultrasonic wire bonding is one of the main methods in the package of the chip and substrate of the chip. The vibrations of transducer were tested. Surrogate-data method of phase-randomized based on correlation dimension is proposed to identify the nonlinear chaos of data obtained by ultrasonic wire bonding system. The result indicate there is nonlinear factor in the axial direction of the amplitude...
Driving voltage and current signals of piezoceramic transducer (PZT) were measured directly by designing circuits from ultrasonic generator and using a data acquisition software system. Input impedance and power of PZT were investigated by using Root mean square (RMS) calculation. Vibration driven by high frequency was tested by laser Doppler vibrometer (PSV-400-M2). Thermosonic bonding features were...
The effect of the temperature on bondability and bonding process for wire bonding are investigated. Bondability is characterized by shear bonding strength and bonding process is represented by input and output power of ultrasonic transducer. A laser Doppler vibrometer and Labview software were used to record the velocity, voltage and current of transducer at different temperature settings. A K-type...
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