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Here, we report a facile strategy for the preparation of polymer shell/gold nanocomposites with enhanced fluorescence. The nanocomposites were synthesized using two main steps. First, gold nanoparticles were prepared via a butenoic acid reduction method, which directly functionalized the nanoparticle surfaces with vinyl groups. The gold nanoparticle surfaces were then encapsulated with polymer shells...
In this paper, we investigated the reliability test for Glass interposer. The test vehicle is assembled glass interposer with chip, BT substrate, and PCB. The structure of a glass interposer with two RDL on the front-side and one RDL on the backside had been evaluated and developed. Key technologies, including via fabrication, topside RDL formation, micro-bumping, temporary bonding, silicon and glass...
In this work, we report a facile method to prepare biocompatible fluorescent core–shell structured nanoparticles. The as-prepared nanoparticle was composed of a gold core enclosed in a protein shell. An amine-reactive fluorophore, 5-(and-6)-carboxyfluorescein-succinimidyl ester, was assembled onto the outer shell completing the fluorescent nanoparticle. Fluorescence quenching of the fluorophore was...
In this paper, we investigated the assembly characterization for reliability test. The structure of a glass interposer with two RDL on the front-side and one RDL on the backside had been evaluated and developed. Key technologies, including via fabrication, topside RDL formation, micro-bumping, temporary bonding, glass thinning and backside RDL formation, were developed and integrated to perform well...
The rework rate following the PDCA-based metrology and the cause-and-effect diagram indeed obtained the significant improvement during the four-month record. The root causes in abnormal PR coating inducing the rework can be cardinally classified as three types: harmful familiarity for the staff, the staff not following the SOP and the defects coming from the previous sputtering process. During these...
With the seven quality control methods under the CIP control, the entire package yield in micro-bump products is promoted from 99.31% to 99.58% during four-month record and tracking. Through these effective and analytical efforts, the rework ratio in the abnormal PR coating contribution was decreased from 0.29% to 0.19%. The result for the auto misalignment was reduced from 0.23% to 0.13% as well...
Peer interaction plays an important role during the learning process. Currently predominant paradigm of digital learning materials limits learners' interaction with their peers using traditional user interfaces. To cope with this problem, this study proposes an embodiment-based learning environment to facilitate more peer interactions. The effectiveness of the environment is evaluated by designing...
Before the wire bonding or flip-chip package is executed, the die-attachment process must be implemented first. In this study, we observe that the quality, sticking process, epoxy-resin diffusion and thickness of silver paste agglutinating the die and the lead-frame critically determine the final package performance.
The electroplating methodology in assembly is better than the stencil printing manufacturing in pre-WLCSP (wafer-level chip-scale packaging), especially in quality. Through eight-step process requiring one photolithographic mask, the pre-WLCSP procedures for the electroplating solder bump technology are able to be completed. Comparing this technology with the electroplating gold bump technology, the...
The material quality, species and orientation of nozzle usually dominate the throughput, bonding reliability and bonding yield of dispenser in bonding technology of assembly. Promoting these needs is a key factor to enter the fine-pitch package field and satisfies the high-density packaging competition.
The molding technology in IC assembly is to protect the ICs avoiding the external damage and indirectly provide the heat dissipation. The molding pattern design, transfer-mold system, providing the drawing pipeline for liquid molding compound in molding is not only the technical index, but the key in the assembly throughput. Furthermore, the integrity of molding compound in plastic assembly is the...
In general, the stencil printing manufacturing in pre-WLCSP (wafer-level chip-scale packaging) is able to be integrated by 7-step processes, including two masks and one set of stencil plate. After the formation of solder ball, the specified professional probe card is needed to verify whether the electric functions of this packaged IC are good. After this step, the wafer grinding, the wafer cutting,...
In flat panel displays, the assembly format of driving ICs, due to the rectangular chip shape, is usually with a difference of conventional commercial ICs constructed with a square configuration. Because of this concern, the electroplating gold bump technology in package was desirably developed. Additionally, in the characteristics of hardness, melting point, and stability, gold material is generally...
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