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The thermal gradient induced intermetallic compound growth at the cold side of the Cu/Sn/Cu and Cu/Sn–3.5Ag/Cu solders heated at 350° has been in situ studied using synchrotron radiation imaging technique. Finite element model for thermotransport of Cu from hot end to cold end in Cu/Sn/Cu solder is implemented for the description of the associated growth of the compound. Higher temperature and bigger...
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