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In order to achieve more functions in certain size of the chip, and avoid RC delay caused by long-range interconnect under high density 2D encapsulation at the same time, the researchers focused on the Z direction — 3D packaging. With the increase of storage capacity, and the large scale of data logic fever problems will more and more obvious. So it will not be able to an unlimited number of laminated...
In this paper, we demonstrate a novel flexible gas sensor based on polypyrrole (PPy) coated SnO2 nanoparticles that can be employed to detect low concentrations of NO2 (0.5 – 5 ppm) at room temperature. This low-cost, easy-fabrication and wearable gas sensor was fabricated on PET substrate. The sensitive film was formed by first drop casting the solution of SnO2 nanoparticles and FeCl3 on the as patterned...
The fabrication of embedded passives represents a promising solution for system in package (SiP) regarding the reduction of size and assembly costs. But the thermo-mechanical deformation caused by residual stress generated from embedded passives processing have a significant impact on reliability of embedded passives. Due to the complication of embedded passives processing, there are several challenges...
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