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Hydrogenated bisphenol A epoxy resin was cured using different kind of curing agents, resulting in epoxy networks with better shape memory properties than bisphenol A epoxy networks. The non-isothermal curing kinetics investigated by differential scanning calorimetry (DSC) demonstrated that hydrogenated bisphenol A epoxy showed lower curing reactivity than bisphenol A epoxy, while it still could be...
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