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This paper investigates the switching performance of a 1.2 kV half-bridge SiC MOSFET module from Sanrex. Unlike in a standard SiC MOSFET module, where the MOSFET and the anti-parallel diode chips are fabricated separately, in the chosen MOSFET module (FCA150XB120), both the MOSFET and the diode are fabricated on a single chip. The device is characterized under both hard and soft switching conditions...
This paper investigates the switching performances of two state-of-the-art half-bridge SiC MOSFET modules using a standard double pulse test methodology. A deliberate choice of the modules with the same voltage and current ratings, the same packaging, but different stray inductances and capacitances is made in order to give an insight into the influence of parasitics in the switching transients and...
This paper investigates the soft switching performance of a 1.2 kV half-bridge SiC MOSFET module, FCA150XB120 from Sanrex. The selected module has both MOSFET and diode integrated on a single chip. A single pulse control circuit is employed in a half-bridge series resonant inverter topology with a split dc-link and an LC load in order to emulate a real inverter operation. This results in a square...
This paper investigates the switching performance of six-pack SiC MOSFET and Si IGBT modules for motor drive applications. Both the modules have same packaging and voltage rating (1.2 kV). The three bridge legs of the modules are paralleled forming a single half-bridge configuration for achieving higher output power. Turn-on and turn-off switching energy losses are measured using a standard double...
This paper explains the importance of low inductive busbar for utilizing the fast switching feature of SiC modules. A 3D FEM model of the busbar is built using Ansys Q3D extractor. The simulation results give insight into the physical behaviour of the current flow which aids in the identification of the parts of the structure that must be considered coplanar. The simulated busbar inductance is compared...
In this paper, the switching performance of a six-pack SiC MOSFET module (CCS050M12CM2) is investigated experimentally using a standard double pulse test method. The upper three and the lower three MOSFETs of the CCS050M12CM2 are paralleled forming a half-bridge configuration. Moreover, the performance comparison of the CCS050M12CM2 is carried out with a pin to pin compatible Si IGBT module (FS75R12KT4_B15)...
In this paper, the impact of using parallel SiC MOSFETs as the switching device is investigated. Measurement considerations for a double pulse test are discussed, and the influence of the load inductor characteristic and the voltage measurement technique on the measurement results is demonstrated. It is shown that the inductor load can produce high frequency oscillations of up to 10 % of the load...
Silicon carbide (SiC) has superior material properties appropriate for transistor applications at high frequency, high voltage, high power and high temperature. These properties give SiC transistors low conduction losses and fast switching capability. This paper addresses the dynamic characteristics of available SiC power transistors including JFETs, BJTs and MOSFETs which are quite promising for...
Silicon Carbide is the promising technology for the applications in high frequency, high voltage, high power and high temperature, principally due to their low conduction losses and fast switching capability. The aim of this paper is to test and evaluate the dynamic characteristics of SiC transistors and describe the utilization of full performance of SiC for photovoltaic applications. A standard...
By characterizing the mobility of Si-face/C-face of SiC graphene before and after stacking the layer of HfO2 with a polyvinyl alcohol (PVA) treatment on the device active layer, we have explored the properties of SiC based epitaxial graphene and the effects of the dielectric film with PVA treatment. Epitaxial graphene grown on the carbon face produces a higher mobility than film grown on the silicon...
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