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A swing-arm conditioning is generally adopted for chemical mechanical polishing (CMP) system to recover the surface roughness of polishing pad. However, the conditioning process results in uneven pad profile. During conditioning, locally excessive pad wear relates to the pad lifetime in CMP process. In this paper we investigate on the relationship of locally controlled swing condition and maximum...
The pressure delivered the wafer is an element that plays an important role for its local and global planarization in a chemical mechanical polishing process. The non-uniform pressure distribution of the wafer edge especially produces productivity and economic loss in semiconductor device production, and the non-uniform pressure distribution is largely dependent on the pressure change of the retainer...
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