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Fabrication of high aspect ratio through silicon vias (TSVs) in a Si interposer and fine pitch solder microbumps on a top Si die is discussed in this paper. Chip stacking result of the Si interposer and the top Si die is also presented. TSVs with 25 in pitch and aspect ratio higher than 10 are etched with BOSCH process. To avoid difficulties in wetting the sidewall of the TSVs, bottom-up...
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