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In this paper, compact optical subassemblies are demonstrated based on a novel silicon interposer, which is designed and fabricated in a wafer scale process. The interposer includes the design of optical and electrical connections. A low-cost fabrication method, wet etching, is used to define light inputs and outputs as well as create the required recesses in the interposer to embed the chips into...
In this paper, we demonstrate a way of packaging CMOS ICs and optoelectronics, which has been achieved by using a deeply wet etched silicon interposer. The silicon interposer concept is used for the assembly of electronics (drivers, TIAs), photonics (VCSELs, PDs) and mechanical optical interface (MOI) and can be fabricated on full wafers. Only four steps of lithography are needed to fabricate the...
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