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The feasibility of transforming completed CMOS/MEMS circuitry and designs from their rigid form realized in a silicon chip into a stretchable system is investigated by fabricating matrix arrays of silicon segments mechanically interconnected with deformable beams. High aspect ratio silicon beams are used both as molds and scaffolds for fabricating structures of Parylene and silicon-Parylene beams...
This paper presents wafer-level packaging (WLP) solution for RF-MEMS applications based on through-wafer via (TWV) technology in high-resistivity silicon (HRS). A pre-processed HRS capping wafer containing recesses and vertical Cu-plated TWV interconnect is, after alignment, bonded to the RF-MEMS wafer providing environmental protection and easy signal access. Optionally, cavities can be formed simultaneously...
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