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A three-dimensional (3D) profile simulator that integrates aerial image module, exposure module, post-exposure bake (PEB) module and development module is presented in this paper for the inclined/multi-directional ultraviolet (UV) lithography of negative thick photoresist such as SU-8. Based on the scalar diffraction theory, the improved paraxial approximation and Fresnel approximation solutions are...
A two-dimensional (2D) simulator that integrates aerial image simulation two-dimensional (2D) simulator that integrates aerial image simulation module, exposure simulation module, post-exposure bake (PEB) simulation module and development simulation module is presented for the deep UV lithography of thick photoresists such as SU-8 photoresists. A method based on Fresnel diffraction is developed to...
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