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In this paper, we take the typical LCCC electronic package structure as the research object, which is under the load of temperature cycle, and evaluate the thermal fatigue life of its solder joint based on the strain fatigue model and finite element method (FEM), and then predict its thermal fatigue life by using the engineering algorithm of electronic package structure. The results show that the...
Solder joint thickness has an important effect on the fatigue failure behavior of solder joint. In this study, fatigue behavior of solder joints with different solder thickness (0.1mm, 0.2mm, 0.3mm) were studied under 398K. The failure path and rupture morphology were observed utilizing scanning electron microscopy (SEM) in order to reveal the failure mechanism. Moreover, fatigue life was evaluated...
Solder joint thickness has an important effect on the fatigue failure behavior of solder joint. In this study, fatigue behavior of solder joints with different solder thickness (0.1mm, 0.2mm, 0.3mm) were studied under 398K. The failure path and rupture morphology were observed utilizing scanning electron microscopy (SEM) in order to reveal the failure mechanism. Moreover, fatigue life was evaluated...
In recent years, agriculture and animal husbandry alternate each other frequently in Western of song nen plain. To understand the alternation between agriculture land and grass land and the factors which cause those changes could provide scientific basis for the protection of regional environment. Based on the technology of RS and GIS and meteorological data during 1959∼2008 and land use data from1956...
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