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A combined wafer bonding method consist of spot pressing bonding technique and water glass adhesive layer is proposed. The mechanism of water glass bonding is investigated, and the two major factors in this bonding method: surface energy and voids formation has also been discussed.
Software evolution is characterized by its changing in accord with environment and requirement. It is one of the most difficult and important problems of software. From the runtime perspective, it includes two types: static evolution and dynamic evolution. Static evolution is mainly implemented by human static intervention and analysis. Dynamic evolution is based on the runtime evolution of software,...
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