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This paper reports on the flattening of a rough surface of an electroplated Au pattern on a Si wafer by the thermal imprint process and its application to surface-activated room-temperature bonding. An ultra-flat sapphire wafer was pressed onto the rough surface of an electroplated Au pattern on a Si wafer for 10min at 200°C with an applied pressure of 150MPa. As a result, almost entire area of the...
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