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Head-in-Pillow (HiP) defect is a common issue in the Ball Grid Array (BGA) assembly. The defect is caused by several factors, individually or jointly, which includes warpage, misalignment, oxidation of the BGA ball, solder paste oxidation barrier capability, ect. The influence of before-reflow misalignment on HiP ratio(%HiP) has been studied. However, before-reflow misalignment can't describe HiP...
Head-in-Pillow (HiP) defect is a common issue in the Ball Grid Array (BGA) assembly. The defect is caused by several factors, individually or jointly, which includes warpage, misalignment, oxidation of the BGA ball, solder paste oxidation barrier capability, ect. The influence of before-reflow misalignment on HiP ratio(%HiP) has been studied. However, before-reflow misalignment can't describe HiP...
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