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Reliability analysis based on failure mechanism takes advantage of unnecessary requirement for the field data, compared with the traditional method based on probability statistics. Current reliability analysis for systems based on failure dependence mainly focus their views on either failure level or failure process level, but barely from the aspect of failure mechanism. Our previous work used Mechanism...
With the development of substation technology, the data collected by automation systems increasingly distributed and discrete. The electric power system has a large number of applications running in a specific time sequence, failure analysis also depends on the sequence of events record. And time synchronization is the link of these discrete data, therefore, time synchronization technology is a key...
This paper introduces a new low-Ag lead free solder alloy which possesses lower cost and higher performance. Also, the new alloy shows some satisfactory properties in solderability, HTS aging resistance, thermal cycling resistance, Shear strength, vibration shock aging and electromigration resistance. Experiments results indicated that both Ni and Bi elements in the low-Ag lead free solder alloy could...
In the vibration environment, electronic products may have fatigue failure, which affects its reliability level seriously. Therefore, it is important to estimate the vibration fatigue life of electronic products. The common used vibration fatigue model is Steinberg model which is necessary to be studied. This paper analyzes the derivation of Steinberg vibration fatigue model. Assumptions and simplifications...
In this study, effect of temperature on failure mode of Sn3.0Ag0.5Cu (SAC305) solder joint was studied under vibration loading. Statistical results indicated that crack mainly occurred in IMC /copper pad and IMC/ bulk solder under single vibration loading. The dominant failure mode was crack of IMC. While under temperature-vibration hybrid loading, crack path shifted from IMC to bulk solder. The dominant...
Board level package reliability under mechanical shock has always been a great concern for mobile electronic products. As a result of “short to market” demand for new electronic products, a great effort has always been made towards developing more efficient methods for reliability assessments. This paper presents a board level mechanical reliability test method based on harmonic vibration. Numerical...
Accidentally drop induced board level intercom-nects break has become one of the most important failure modes for portable electronic products. Board level drop impact test is widely used to evaluate the mechanical shock reliability of electronic assembly interconnects. In this paper, PCB responses during drop impact and vibration shock are compared using strain measurements. The loading similarities...
This paper develops and demonstrates a taxi pre-alarm system which is based on transportation hub information platform and urban taxi information platform and running in transportation hub in order to maintain continuous, enough and rational taxi supply and aiming at improving the taxi service lever of transportation hubs. The system is mainly made up of three key models: real-time taxi-demand estimate...
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