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In this study, effect of temperature on failure mode of Sn3.0Ag0.5Cu (SAC305) solder joint was studied under vibration loading. Statistical results indicated that crack mainly occurred in IMC /copper pad and IMC/ bulk solder under single vibration loading. The dominant failure mode was crack of IMC. While under temperature-vibration hybrid loading, crack path shifted from IMC to bulk solder. The dominant...
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