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A compact folded interdigital bandpass filter using low temperature co-fired ceramic (LTCC) technology is proposed. Strong capacitive couplings between the double-layer coupled stripline resonator structure are introduced to realize miniature bandpass filters. A design of an eight-pole Chebyshev folded filter with such structure is performed in this paper. The simulation response exhibits an insertion...
A novel millimeter-wave LTCC based on three-line stripline structure wideband bandpass filter is presented. Folded structures are employed to realize minimization. Compared with traditional three-line structure, the presented structure can easily expand the passband with using much more compact 3-D structure, and introduce one transmission zero by putting resonators in a folded way, so that the rejection...
In this paper, a new kind of dual-mode Folded Substrate Integrated Waveguide (FSIW) filters in K-band with Low-Temperature Co-fired Ceramics (LTCC) technology is proposed. Dual-mode FSIW filter of single resonant cavity is designed to degenerate two modes: folded TE201 and TE102, which results in two transmission zeros on each side of the pass-band. To further validate its characteristics, a dual-mode...
In this work, we propose a novel millimeter-wave SIW bandpass filter (BPF) that combines the technology of E-plane iris filter, SIW and LTCC. This filter with equivalent E-plane iris mounted in SIW is buried in LTCC substrates, and has a pass bandwidth from 34.1GHz to 35.9GHz. The insertion loss is less than 1.8dB and the return loss is better than 21dB in the entire pass band.
This paper deals with an embedded multilayer LTCC interdigital bandpass filter. This compact filter is used in LTCC transceiver module to suppress the unnecessary frequency components in LO branch. According to validation, measured results are in good agreement with simulated results. The passband insertion loss and stopband suppression at concerned frequency points accomplishes suppression desires...
In this letter, the support vector machine (SVM) regression approach is introduced to model the three-dimensional (3-D) high density microwave packaging structure. The SVM is based on the structural risk minimization principle, which leads to a good generalization ability. With a 3-D vertical interconnect used as an example, the SVM regression model is electromagnetically developed with a set of training...
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