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In this paper, we were trying to optimize bondline thickness of sintered nanosilver on assembling high power laser diode modules (40 W). The shear strength and void ratio of the sintered joints were reported in this work. Cavity surface contamination was discussed in cases of different as-printed bondline thickness. The electro-optical properties of the sinter-packed laser diode module by sintering...
This paper is mainly reported to a pulse reliability investigation of high power single emitter laser modules with nanosilver paste. Comparative experiments in continuous pulse conditions for the laser modules packaged with nanosilver paste, indium and AuSn solders were conducted. The results indicate that the laser modules attached by nanosilver paste have a longer-term lifetime than those with indium...
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