Search results for: Chin C. Lee
Ultrasonics > 2012 > 52 > 4 > 555-563
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2012 > 2 > 6 > 903 - 908
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2012 > 2 > 2 > 194 - 198
Journal of Materials Science: Materials in Electronics > 2012 > 23 > 12 > 2235-2244
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 9 > 1311 - 1318
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 8 > 1178 - 1185
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2011 > 1 > 12 > 1983 - 1987
Journal of Materials Science: Materials in Electronics > 2011 > 22 > 9 > 1313-1320
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control > 2010 > 57 > 12 > 2784 - 2794