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Significant stress is induced in the crystalline Si area around a Cu-filled Through Silicon Via (TSV) due to the large mismatch in the co-efficient of thermal expansion (CTE) between Si and Cu. As a result, CMOS devices fabricated within the stressed Si region will show undesired variations in their electrical performance. This paper reports a novel method to isolate the TSV-induced stress from active...
Recently, a novel diesel particulate filter with catalyst coating draws much attention as its great performance of reducing diesel soot. In this paper, we established a mathematical model to predict and describe the pressure drop of DPF, soot loading and regeneration process. The results shows that: the model could effectively reveal the soot mass change in DPF; high flow rate causes high pressure...
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