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In present study, an interesting phenomenon of solder bridging presents in fine pitch BGA device is reported. The failure mechanism is investigated by solder formation modeling, and examined by experimental results of multi-factors evaluation. Results show that the risk of adjacent joints bridging is highly influenced by printed circuit board design attribute. A mathematic model is applied to describe...
In present study, an interesting phenomenon of solder bridging presents in fine pitch BGA device is reported. The failure mechanism is investigated by solder formation modeling, and examined by experimental results of multi-factors evaluation. Results show that the risk of adjacent joints bridging is highly influenced by printed circuit board design attribute. A mathematic model is applied to describe...
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