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This paper presents a optimal design approach of step stress accelerated degradation test (SSADT) for quartz flexible accelerometers under the assumption that the degradation of each accelerometer follows a Wiener process and the degradation rate at different stress levels satisfies an Arrhenius function. The asymptotic variance of the pth percentile of lifetime is adopted as optimization objective...
This study focuses on a method of reliability assessment for creep corrosion on immersion silver-finished PCBs utilizing the mixed flow gas (MFG) test and clay test. Four kinds of locations were defined to conveniently describe the location from which the dendrite corrosion products were growing: IL refers to the location that corrosion products grew from a hole or pad edge with solder mask; IIL refers...
Plated through hole (PTH) failure due to CTE-mismatch-induced fatigue is a major interconnection failure in electronic products. The IPC methodology that is widely used in industry for PTH reliability assessment assumes a uniform thermal stress distribution in PTH barrels and considers no effect of peripheral PTHs on the one under investigation. As a result, IPC-methodology-based PTH reliability assessment...
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