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Alloy powder is the main material of solder and the type, shape, size distribution and content will affect the rheological properties of the paste, thereby affecting the printing performance of the solder paste. A comprehensive research of the complicated interactions among these factors will be very essential to develop high performance solder pastes for future jetting. This paper investigates the...
Surface Mounted Technology (SMT) is a universal technology used in electronics packaging industry. Electronic manufacturing industries have utilized advanced Integrated Circuits(IC) packages to achieve the manufacture of smaller, lighter, faster and cheaper products. However, the assembly of these surface mounts packages and the reliability of the products are challenged by solder paste printing process...
The flux system of solder paste play the most important roll in the assembly of surface mount devices in electronic industries. Rheology of solder paste is the most important parameter which affects the paste jet printing process, the solder jet printing performance affects solders joint quality and reliability directly. A clear understanding of the influence of solder flux on solder rheology and...
Solder paste is the most important strategic bonding material used in the assembly of surface mount devices in electronic industries. Rheology of solder paste is the most important parameter which affects the paste printing process, the reflow soldering performance, and wherefore the resulting solders joint quality and reliability. A clear understanding of the complicated interactions among various...
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