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Compared to conventional metal heat sinks, CNT-based microfins have exceptional advantage to drag heat out from electronic components due to the unique thermal and mechanical properties of the material. This paper will review the state of CNTs applied as cooling fins in microelectronic systems. The latest progresses will be presented.
Process variation is expected to persist in the various novel nanoscale fabrics being proposed to replace CMOS. Logic circuits built using non-traditional and bottom-up techniques will need to meet new design rules, such as tolerance of high defect rates and use of regular structures in layout. One circuit fabric type that meets these requirements is grid-based logic, with built-in fault resilience...
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