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Implementation of thick Cu inductor in IC chips has been a highly challenging task for Far-backend packaging industry. One of the major concerns is that the thicker Cu trace wrapped by re-passivation polymer layers (Polymer-1 & Polymer-2) is often accompanied by remarkable internal stress in the overall package, which is plagued with the risk of layer-to-layer delamination and/or interface micro-cracks...
The mechanical behaviors of two kinds of hydrogenated Ti-6Al-4V alloy were investigated in quasi-static (material testing machine) and dynamic (split Hopkinson pressure bar) compression test. The stress-strain curves were obtained over the range of strain rates from 10-3s-1 to 1.5×103 s-1 and temperatures from 20°C (room temperature) to 700°C. The strain rate and temperature sensitivity of plastic...
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