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This paper presents a new chip-on-flexible (COF) packaging structure for flip-chip (FC) light-emitting diode (LED). Two bonding methods, AuSn and Sn–Ag–Cu (SAC) soldering, were compared from thermal, mechanical, and optical performances of the packages. Compared with the package by AuSn soldering method, the package by SAC soldering method showed lower chip temperature due to the avoiding of the large...
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