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3D integration by means of face-to-face (F2F) stacking of wafer-on-wafer (WoW) is successfully demonstrated using bump-less Cu-Cu bonding on 200 mm wafers. Cu surface topology is optimized and carefully cleaned prior to bonding. Bonded Cu structures provide sufficient mechanical strength to sustain shear force during wafer thinning. Excellent specific contact resistance of ~0.34 Ω.μm2 is obtained...
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