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In this study, we present the development of a highly reliable 64
× 64 Mini‐LED display, where the LED array is
transferred/bonded onto a glass substrate using SITRAB
technology and materials. The display substrate was fabricated by
patterning two layers of Cu on top of heat‐resistant glass with a
thickness of 500 μm. We applied SITRAB solder paste containing
type 6 solder powder based on a...
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