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One of the major factors that affects the overall efficiency and reliability of power electronics systems is the dynamical variation of the thermal stress which occurs in the power semiconductor devices. Therefore, the main objective of this paper consists of designing and implementing a series of active thermal control methods for the power devices of a motor drive application. The motor drive system...
This paper introduces an advanced gate driver used as thermal swing control method for the reduction of AC load current-related ΔTj in Insulated-Gate Bipolar Transistors (IGBTs). A switchable gate resistor network is applied to the advanced gate driver, so that the switching power losses can be changed according to the amplitude of AC current. Accordingly, a closed-loop thermal control method including...
Modular Multilevel Converter (MMC) has recently become a popular multilevel topology for high-power applications, where the reliability performance is a crucial design consideration. In this paper the impacts of the circulating current in the MMC to the loss and thermal loading of power semiconductor devices are comprehensively investigated. Also a novel control strategy by utilizing the circulating...
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