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In modern semiconductor manufacturing facilities, metrology capacity is becoming limited because of the high equipment cost. This paper studies the problem of optimally assigning the capacity of multiple identical metrology tools in order to minimize the risk of defective wafers on heterogeneous production machines. We assume that the output of each production machine is assigned to only one metrology...
Semiconductor manufacturing is highly complex and expensive, hence the early detection of problems is necessary to minimize the number of scraps and improve the overall yield. This paper presents an industrial application of dynamic sampling based on an aggregated risk indicator at process tool level. The objective is to identify the lots that should be measured to minimize the overall risk level...
In this paper, we propose new ways for efficiently managing defect inspection queues in semiconductor manufacturing when a dynamic sampling strategy is used. The objective is to identify lots that can skip the inspection operation, i.e. lots that have limited impact on the risk level of process tools. The risk considered in this paper, called Wafer at Risk (W@R), is the number of wafers processed...
In this paper, we introduce a mathematical model for estimating the use of defect inspection capacity. Until recently, the selection of lots to be inspected was only done at the beginning of the manufacturing process. With the introduction of dynamic controls on production tools, the selection of lots to be inspected is done according to the production state. Our problem focuses on the Wafer at Risk...
In a worldwide environment, sustaining high yield with a minimum number of quality controls is key for manufacturing plants to remain competitive. In high-mix semiconductor plants, where more than 200 products are concurrently run, the complexity of designing efficient control plans comes from the larger amount of data and number of production parameters to handle. Several sampling algorithms were...
This paper presents a lot dispatching strategy to reduce the Wafer at Risk (W@R) on process tools, i.e. the number of wafers processed between two defectivity inspections. Due to the highly complex manufacturing process and the molecular scope of operations, defectivity inspections are critical for sustaining high yield levels of products. The novel dispatching strategy guides operators in selecting...
In order to minimize yield losses due to excursions, when a process or a tool shifts out of specifications, an algorithm is proposed to reduce the scope of analysis and provide in real time the number of lots potentially impacted. The algorithm is based on a Permanent Index per Context (IPC). The IPC allows a very large amount of data to be managed and helps to compute global risk indicators on production...
In this paper, we analyze the impact of control plan design of defectivity inspections for tool risk management. Defectivity inspections are performed on products and can reveal the yield loss produced by contaminations or structural flaws. The risk considered in this paper concerns the exposure level of wafers on a tool between two defectivity controls. Our goal is to analyze how control plans can...
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