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It is known that breakdown strength of SF6 is extremely susceptible to non-uniform electric fields and metallic particle contamination, these effects lead to lower the breakdown voltage. Furthermore, from the view point of environmental protection, as SF6 has strong greenhouse effect, the use of SF6 will be strong controlled. Thus, it is needed to develop the alternative dielectric gas or gas mixtures...
With the efforts being done to make the existing power network smarter and efficient, thermal monitoring of transformers has become the demand of the day in the field of transformer engineering. Theoretical methods available and practical measurement techniques will not suffice, hence the development of thermal modeling techniques that can measure the thermal profile across the transformer at desired...
This paper presents a new parallel processing wire routing machine, which finds a quasi-minimum Steiner tree for multi-point connections in a VLSI chip. A hardware implementation with concurrent time-multiplexed wavefront propagation from all terminals of a net is described. The new design requires fewer clock cycles to find the shortest path than the existing parallel routing algorithms. The time-multiplexed...
This paper presents a new parallel processing wire routing algorithm, which finds a quasi-minimum Steiner tree for multi-point connections in a VLSI chip or a PCB. A VHDL code is written to implement the algorithm on a prototype 4times4 and 8times8 single layer grid. Two methods are proposed for the design of processing element. The algorithm has been successfully tested on a XC2VP30 Virtex-II Pro...
Ti/Cu/Ni Under Bump Metallization (UBM) structure is used for eutectic. i.e.. 63Sn37Pb. solder bump with Ti for adhesion and seal. Cu as current earning layer, and electroplated Ni as diffusion barrier. In this study, the effect of the integrity of UBM structure within a passivation via, particularly the integrity of Ni barrier layer, on the product long-term reliability has been investigated. The...
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