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The microvoids formation and morphology of intermetallic compounds formed at the Sn–9Zn/Cu interface with and without Ag addition have been investigated by scanning electron microscopy and energy dispersive spectrometry and pull-off test. The microvoids are formed at the Sn–9Zn/Cu interface after aging at 180°C for 100h and at the Sn–9Zn–3.5Ag/Cu interface after aging at the same temperature for 1000h...
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