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High thermal conductive adhesive is important to cool power devices. Recently thermal conductivity reaches more than 10W/mK by efficient addition of thermal conductive filler. However, high loading of filler makes the thermal conductive sheet poor adhesion. Furthermore, we focused on reducing an interfacial heat resistance between high thermal conductive sheet composed of resin and heat conductive...
The high thermal conductive of 10 to 15 W/mK and high heat durable adhesive film has been developed. It is composite of the imide base high heat durable thermosetting resin and high thermal conductive particles. The 1% and 5% weight loss temperature were 384 and 494°C, respectively. Breakdown voltage of the 200 μm thick film was larger than 5 kV at 50 Hz. Insulation reliability was evaluated at 85°C...
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