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In this paper, Ni-coated graphene nanosheets (GNS-Ni) were synthesized by an in situ chemical reduction method. Such GNS-Ni sheets, by varying their weight fractions (0.05, 0.1 and 0.2wt.%) were successfully incorporated into the SAC305 solder matrix to fabricate composite solders through the powder metallurgy processing method. The samples of composite solders were then investigated in terms of their...
NiCu is one of the widely used thin-film materials, which is now commonly used as sensor and resistor in very-large-scale-integration (VLSI) because of its high resistivity and stability. However, with the scale decreasing and the temperature increasing in service condition, the limited reliability of NiCu thin-film material has been a key issue in microelectronics and packaging industry mainly due...
Thermal design and thermal management are the key issues for electronic products during the trend of miniaturization. Heat sink is one of the promising and popular choices to relieve the thermal problem. In this paper, the effect of heat sink on electromigration (EM) lifetime of Ni thin films is investigated. It is proved that heat sink had no influence on the temperature coefficient of resistance...
In this paper, Ni-coated graphene nanosheets (GNS-Ni) were synthesized by an in situ chemical reduction method. Such GNS-Ni sheets, by varying their weight fractions (0.05, 0.1 and 0.2wt.%) were successfully incorporated into the SAC305 solder matrix to fabricate composite solders through the powder metallurgy processing method. The samples of composite solders were then investigated in terms of their...
Thermal design and thermal management are the key issues for electronic products during the trend of miniaturization. Heat sink is one of the promising and popular choices to relieve the thermal problem. In this paper, the effect of heat sink on electromigration (EM) lifetime of Ni thin films is investigated. It is proved that heat sink had no influence on the temperature coefficient of resistance...
NiCu is one of the widely used thin-film materials, which is now commonly used as sensor and resistor in very-large-scale-integration (VLSI) because of its high resistivity and stability. However, with the scale decreasing and the temperature increasing in service condition, the limited reliability of NiCu thin-film material has been a key issue in microelectronics and packaging industry mainly due...
Self-propagating reaction is presented as a new heat source for the joining of MEMS and high power devices. However, due to the complex thermal process of self-propagating reaction, the temperature in solder or multilayer foil during the joining process is difficult or even impossible to measure and control. Therefore, more simulation efforts should be carried out to get a better understanding of...
The trace elements distribution characteristics of 14 elements of Litchi soil samples were analysed from Zengcheng and Conghua, Guangzhou City, the main results showed that the trace elemets of two Litchi products area soil have the similar change trend in longitudinal and transverse profiles, and the similar distribution characteristics presented in Zengcheng and Conghua by comparing with Guangdong...
By comparative analysis of characteristc distribution, correlation, biological absorption coefficient and the characteristc element pairs of 13 trace elements in Litchi and soils from four production areas, Guangdong province, the results revealed that the characteristic elements of four production areas are Cu, Mg, Zn, Fe, Cr, and the characteristic element pairs are Cu-Li, Cu-Zn, Li-Mg, Li-V, Mg-V,...
In order to improve the nano-fullerene crystals' dispersion, and keep itself excellent performances, the surface metallization is achieved by electro less nickel plating; The preparation of electro less was studied; the micro appearance was watched; the element composition was examined; the Zeta potential of the nano-fullerene crystals was detected; All the results show that way of surface metallization...
This paper describes a novel local heating technique for microelectronic mounting. Aluminum/nickel (Al/Ni) multilayer foils show self-propagating exothermic reactions, driven by a reduction in atomic bond energy which can provide rapid bursts of heat and can act as a local heat source to melt solder layers and join materials. In this work, we demonstrate the validity of the Al/Ni reactive foils as...
In present paper, the effect of miniaturization on the microstructure and mechanical property of solder joints is investigated. With the miniaturization of solder joints, the thickness of IMC decreases, while, the IMC proportion to the solder joint increases; meanwhile, the concentrations of base materials in the bulk also increase with the reducing stand-off height (SOH). Due to the interaction of...
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