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In this study, current stressing experiments were conducted to investigate electromigration of 99.3Sn0.7Cu solder with Au/Ni UBM in BGA packaging. Although the average current density in the solder bump was only 0.4×10 4 A/cm 2 , the maximum value of the current density was 1.42×10 5 A/cm 2 , which exceeded the threshold value for electromigration to occur. Furthermore,...
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