The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Power semiconductor packages are prone to reliability issues related to microstructural changes, thermal fatigue and thermo-mechanical stresses during high temperature operation. This paper evaluates the reliability of various Pb-free Zn-Al-based solder alloys used as die-attached solder during thermal cycling aging. Minimal interfacial intermetallic compounds (IMCs) growth was observed after 1500...
The combination of self-formed barrier (SFB) and extreme low-k (ELK) dielectric is an attractive candidate for interconnect integration beyond 28nm-node regarding to low RC delay and Cu filling. Attempt is made to understand the formation mechanism of SFB through combinations with various ELK dielectrics in this study. In terms of wiring and dielectric reliabilities, the combination of MnxOy SFB and...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.