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The present paper relates to a lead-oxide-free copper thick-film paste for printing on ceramic substrates, especially on alumina. Commercialized copper thick-film pastes usually consist of copper powder with lead-oxide glass, which should be avoided in regard to the RoHS Certificate of Conformity. The screen printing technology could be an alternative method instead of the standard DCB process, particularly...
The past years saw a marked increase in power density for packaged LEDs and also an increase in requested lifetimes for the same modules. This leads to the need for substrate materials that show an improved thermal conductivity and reliability over standard FR4 or insulated metal substrates. Direct copper bonded (DCB) substrates offer a significantly lower thermal resistance and have already become...
A novel heat pipe design was developed consisting or a ceramic substrate sandwich with integrated flat heat pipe. On both sides of the heat pipe active electronic components, such as IGBT's or MOSFET's, can be mounted on an etched copper circuit. Heat densities over 80 W/cm2 can be dissipated easily. The functionality is independent of the working position either horizontal or vertical. The heat pipe...
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