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Background Females who perpetrated violence in the community have important mental health and public protection implications. There is a dearth of research in this area. This study investigated the prevalence of psychiatric morbidity, personality disorders as well as victim characteristics and violence risk factors of women in the community who self-reported violence against others. Methods The...
One promising application of CNTs in microelectronics is to use vertically aligned CNT (VACNT) arrays as novel thermal interface materials (TIMs). CNTs have high intrinsic thermal conductivity, a combination of flexibility and rigidity, small coefficient of thermal expansion and high thermal and chemical stability, etc. However, large interfacial thermal resistance between CNTs and contact substrates...
The advances of semiconductor technology are highly dependent on the advances of polymeric materials. These include the use of polymers as adhesives (both conductive and nonconductive), interlayer dielectrics (low-k, low loss dielectrics), encapsulants (discrete and wafer level packaging), embedded passives (high-k and high-Q materials), superhydrophobic selfcleaning lotus effect surfaces, etc. In...
The successful implementation of a magnetic composite material has enabled the investigation of the potential impact on RFID and RF passives miniaturization, considering both material/fabrication properties and geometric design parameters. The benchmarking structure is a short-circuited quarter-wavelength rectangular patch antenna for RFID UHF band (400 -930 MHz). The antenna is electromagnetically...
Recently, anisotropic conductive adhesives (ACAs) have attracted increasing interests in electronic packaging industry due to the advantages of ultra fine pitch capability potential (pitch <20 mum due to the availability of micro-sized conductive particles), low processing temperatures, low stress on substrate, environmentally friendly, etc. In this study, effects of nano silver (Ag) particles...
High-k materials with manufacturing processes capable of achieving continually high density for decoupling applications are believed to be one of the key issues to enable the extendibility of Cu/Low-k technology. Filled polymer nanocomposites are potentially one of such high-k materials because this approach can combine the low-temperature (<250degC) processibility of the organic polymer matrix...
Recent advances in polymeric materials and integrated circuit (IC) encapsulants have made high-reliability very large-scale integration (VLSI) plastic packaging a reality. High-performance silicone gel possesses excellent electrical and physical properties for IC protection. With their intrinsic low modulus and soft gel-like nature, silicone gels have become very effective encapsulants for larger,...
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