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A novel low-temperature, pressureless bonding approach by electroless plating with controlled flow through a microfluidic device, in which a laminar forced convection flow of electroless solution was passing through a microchannel between dies and to gaps between copper pillars, was developed to metallically interconnect copper pillars together. Previous study had been demonstrated that, with the...
High bonding temperature and force are known to cause physical damage to the device. The objective of this present study is to develop a new low-temperature and pressureless bonding method for Cu-to-Cu interconnects using electroless Ni plating. Two plating methods were employed to test the feasibility of electroless bonding of copper pillars. The first method was carried out in a stirred plating...
While most therapies fail to contain metastasis, immunotherapies have had promising success on patients with renal or melanoma cancer metastasis.Immune–cancer cell interactions are therapeutic targets for preventing metastasis. Recently, drugs targeting these interactions have been shown to prevent cancer progression and have received FDA approval. Many more immune–cancer cell interactions are being...
Microfluidics technology shows excellent potential for applications in biotechnology, chemical sensing, and drug delivery. The use of microfluidics results in cycle time reduction, reagent cost and labor intensity savings due to the benefits of miniaturization, and functional integration. As a result, miniature DNA sample preparation and analytical devices may potentially become part of a point-of-care...
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