Search results for: Huiming Ji
Materials Letters > 2016 > 165 > C > 131-134
Journal of Alloys and Compounds > 2016 > 657 > C > 684-690
Journal of Materials Science > 2016 > 51 > 3 > 1418-1427
Journal of Materials Science: Materials in Electronics > 2016 > 27 > 2 > 2086-2095
Thin Solid Films > 2015 > 590 > C > 124-133
Materials Science in Semiconductor Processing > 2015 > 36 > Complete > 65-70
Journal of Alloys and Compounds > 2015 > 637 > Complete > 291-296
Transactions of Tianjin University > 2015 > 21 > 3 > 228-233
Journal of Materials Science > 2015 > 50 > 22 > 7488-7494
Journal of Materials Science: Materials in Electronics > 2015 > 26 > 4 > 2082-2089
Journal of Materials Science: Materials in Electronics > 2015 > 26 > 3 > 1474-1484
Journal of Materials Science: Materials in Electronics > 2015 > 26 > 10 > 8217-8223
Journal of Hazardous Materials > 2014 > 276 > Complete > 262-270
Journal of Alloys and Compounds > 2014 > 600 > Complete > 111-117
Materials Letters > 2014 > 124 > Complete > 249-252
Advanced Powder Technology > 2014 > 25 > 3 > 910-915
Materials Letters > 2014 > 120 > Complete > 287-291
Sensors and Actuators B: Chemical > 2014 > 193 > C > 100-106
Journal of Porous Materials > 2014 > 21 > 2 > 127-130
Journal of Materials Science: Materials in Electronics > 2014 > 25 > 4 > 1873-1879