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Electrochemical migration (ECM) – a potential problem in confined multi-layered circuits with narrow connections – was investigated with respect to the heat treatment of silver (Ag) nanopaste screen-printed on polyimide (PI) substrates. The Ag nanopaste patterns were sintered for 30 min at various temperatures. When the sintering temperature was raised from 150 to 300 °C the Ag cluster size increased...
We evaluated the flexibility of screen-printed silver (Ag) circuits under various sintering temperatures. The circuits were built on a polyimide (PI) film by a screen printing technique using Ag nanopaste (73 wt%, 24 nm in diameter, Ag nanoparticles). The sintering temperature was raised from 150 to 300°C while the sintering time was fixed at 30 min. The flexibility was measured by two different kinds...
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