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Hydrostatic stress of Cu damascene interconnects were calculated by using commercial finite element software in the present work. The analytical work was performed to examine the distribution of hydrostatic stress and the effect of different low-k dielectrics and barrier materials in the Cu interconnects. The results indicate that the hydrostatic stress is strongly dependent upon different low-k dielectrics...
Due to their influence on the mechanical properties, residual stresses in thin films have become an important topic in materials science. The elastic constants are required to determine the residual stresses using X-ray diffraction method. The elastic constants of Cu thin films with ideal fibre textures were calculated using the Voigt, Reuss and Hill model in the present work. The results show that...
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