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For stability against the thermal budget of the CMOS BEOL process, we developed a new solid-electrolyte switch that uses a SiO2-Ta2O5 composite as the electrolyte. This switch has high thermal stability because thermal diffusion of Cu+ ions is suppressed in the composite. Moreover, its switching characteristics after thermal annealing are similar to those of a Ta2O5 switch without annealing. The switch...
A solid-electrolyte switch (ldquoNanoBridgerdquo) has been successfully embedded into a 0.13-mum-node dual-damascene Cu interconnect using a highly reliable bilayer solid-electrolyte (TaSiO/Ta2O5) and a thin oxidation barrier, resulting in an excellent ON/OFF ratio (> 109) at a low ON resistance of 50Omega. The newly developed bilayer solid-electrolyte has improved the thermal stability during...
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