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Eutectic Sn-Zn-Al solder alloy was used [composition: 91Sn-9(5Al-Zn)] to investigate the effects of dipping parameters such as the temperature, rate and time dipping on the adhesion strength between solder and substrate using dimethylammonium chloride (DMAHCl) flux. The optimum conditions for the highest adhesion strength (about 8 MPa) were determined as dipping at 350°C, and a rate of 10.8∼11.8 mm/s...
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