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Using a constant load compression test, the creep deformation of 63Sn37Pb solder balls was studied in the load range 0.5–2N and in the temperature range 25–150°C. There was no steady-state creep due to continuous changes in the contact area, which resulted in a decrease in the contact stress. Assuming that the compression velocity was proportional to the uniaxial strain rate and the contact stress...
In the present work, lead-free solder balls were manufactured by a uniform droplet spray (UDS) method. The solder used to produce solder balls was based on the Sn-3.8Ag-0.7Cu alloy. Different amounts of cerium-based mixed rare-earth (RE) elements were added into the Sn-3.8Ag-0.7Cu solder alloy in order to examine the effects of small amounts of RE additions on the physical properties, microstructure,...
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