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The morphology of tin whiskers on the surface of the oxidized RE-Sn phases was observed by SEM. The results show that, besides the regular pencil-shaped whiskers, chrysanthemum-type whisker; spiral whisker; plate-like whisker; whisker with a non-constant cross section; branch-type whisker and joint-type whisker were also found in this study. It is suggested that except for the special case, the stress...
Sn whisker growth is considered as a crucial reliability issue in the electronic packaging industry, especially with the massive application of Pb-free solder alloys. In this paper, we report our fundamental studies on Sn whisker growth through accelerated tests. Excessive rare earth element addition is one way we employed to investigate the kinetics of whisker growth. Several aspects of the morphological...
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