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Bonding wire is used to make an interconnection between ICs and the PCB board. It is small but critical in the structure. In this paper, educational 3D electromagnetic analysis software CST MWS was used to model and simulate several bonding wires with different parameters at high frequency. This paper focuses on relations between parameter changes and transmission performance of bonding wires, forming...
The accurate measurement of near-field EMI of Printed circuit board (PCB) and electronic equipment is essential nowadays. The photoelectric type probe could provide a better solution to the near-field measurement. In this paper, a combined with copper-clad laminate and electron component, the strip line embedded into PCB basal lamina is designed to get a specific frequency response. However, in consideration...
Enhanced dielectric permittivity and conductivity are observed in low-density polyethylene/multiwall carbon nanotubes (LDPE/MWCNT) nanocomposites prepared via a melt-blending process and subsequent a hot-molding procedure when the volume fraction of MWCNT is near the percolation threshold. In comparison to some reported results, the present percolation threshold is high. The high percolation threshold...
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