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The efficient peeling-off of the die from the adhesive wafer tape plays a key role in chip pick-up process, especially, with increasing application of thin/ultrathin chip, which even determines the qualified products ratio. Whether the chip can be peeled off successfully or not, theoretically, dependents on the peeling fracture criterion, that is, the peeling energy release rate obtained by a die...
The efficient peeling-off of the die from the adhesive wafer tape plays a key role in chip pick-up process, especially, with increasing application of thin/ultrathin chip, which even determines the qualified products ratio. Whether the chip can be peeled off successfully or not, theoretically, dependents on the peeling fracture criterion, that is, the peeling energy release rate obtained by a die...
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